The core technologies driving high-speed data transmission provide a complete solution for precision alignment and modular assembly.
With the rapid evolution of cloud computing, AI, and 5G technologies, optical communication components face the challenges of high-speed, high-density, and miniaturized manufacturing processes. We provide automated assembly, precision positioning, and measurement support for key optical communication modules, helping customers accelerate R&D and mass production deployment.
It provides highly stable stages and alignment platforms for optical module assembly, ensuring precise alignment of the optical paths at the transmitting and receiving ends, and supporting the packaging and testing applications of high-speed transmission modules (such as 3.2T, 1.6T, etc.).
GMT GLOBAL is high-precision motorized stages and equipment ensure precise consistency of the optical paths between the transmitter and receiver throughout the entire process of optical module packaging and testing, supporting efficient mass production and high reliability of high-speed transmission modules.
Faced with the demands for high speed and high density, CPO technology is gradually becoming the future trend. We provide ultra-high precision positioning modules that meet the requirements of CPO processes, assisting in the co-packaging of optical components and IC chips.
Silicon Photonics High-Precision Coupling Solution
GMT GLOBAL is motorized stages and equipment have become indispensable core components in CPO co-packaged optical production, facilitating efficient alignment of wafers and optical paths and high-yield mass production.
For the process characteristics of silicon photonics chips, we provide alignment systems and test modules suitable for wafer-level packaging, supporting high-volume processes and high-yield requirements, and applicable to data centers and AI accelerators.
GMT GLOBAL is motorized stage modules, subsystems, and equipment enable high-speed, high-yield packaging and verification in high-volume silicon wafer manufacturing processes, providing a reliable, stable, and easily integrated core positioning solution for data centers and AI accelerators.
In 5G/6G communication applications, we support the precise positioning, bonding, and testing of antenna modules and optoelectronic modules, facilitating the mass production of miniaturized high-frequency components.
GMT GLOBAL high-precision coupling alignment is indispensable in the manufacturing and testing of 5G/6G communication equipment.
