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Solutions for the Semiconductor and Optical Communications Industries

Tx FAU Bonder (Passive Bonding)

Tx FAU Bonder (Passive Bonding)

Function
  • High-Definition CCD Recognition
  • Fixed the FAU after Coupling by UV Glue
Key Point
  • High-Precision Vision CCD to Align X/Y/Z Plane
  • Online Monitoring and Data Uploading to Database

  • Specifications
  • Technical Data
  • Image Download
Product Overview

Updated: April 8, 2025

Product illustration

 

 

Station details

Station

Function

Key Point

Tx FAU
Bonding
‧High-Definition CCD Recognition
‧Fixed the FAU after Coupling by UV Glue
‧High-Precision Vision CCD to Align X/Y/Z Plane
‧Online Monitoring and Data Uploading to Database

 

 

Major equipment

Equipment

Key Parameter

 Bonding
Machine
‧X/Y/Z Resolution:10nm
‧Bonding force:5gF
‧Cycle Time:< 130 sec/pcs (No cover UVtime)

 

 

 

Specification Sheet

Type

Item

Parameter
Facility Requirement
& Appearance
Power Input 220V 50/60 Hz
Pneumatic System Compressed air flow >2LPM;System supply pressure 0.6MPa-0.7MPa
Vacuum System Vacuum gauge reading ≤ -80kPa
Environmental Conditions Temperature:15-35°C;Humidity: standard 70% at 32°C;Cleanliness
level:100k Class
Machine Dimensions 1000mm*1200mm*1800mm
Equipment Weight 850-950 kg
Safety Protection Product security defense Contact grounding treatment
ESD protection Ion fan for electrostatic removal
Software protection Mistake proofing
Equipment protection Collision prevention, axis stroke limit, distance sensor
Operator safety protection Protective goggles
Loading/
Unloading Module
PCB Tray (5pcs, customizable) Linear module + servo motor
FA Tray (5pcs, customizable) Linear module + servo motor
Dispensing Module Structure Configuration Three-axis:XY axis linear step motor + Z axis servo motor + ball screw 
module(supporting  dots and lines); Positioning accuracy:5μm
Dispensing system Musashi high-precision dispensing machine, single-point (needle), 
Standard 3mL capacity, other volumes customizable
UV Curing System Configuration and Parameters Dual LED light source, pneumatic shutter, wavelength 365nm

Bonding system
Clamping Electric gripper and vacuum suction
Gantry System 4 axis:XY linear step motor, Z servo motor with ball screw, θ arc swing: 
0.5um repeat positioning accuracy
Visual System Automatic alignment;500M CCD;field of view:10.6 × 8.9mm; resolution
:2.7μm;depth of field:1.6mm
Bonding Force Control Pressure sensor monitoring:5gF