Advanced Electronics
Large panel assembly requires maintaining high-precision alignment over extremely long strokes. Our long-stroke, high-rigidity stage integrates a linear motor and a vision positioning system to support OLED/LCD module alignment and bonding, achieving high throughput and high uniformity production requirements.
Mobile phone panel module assembly demands minimal offset and high-speed production. We offer a composite stage platform integrating Z-axis and rotary axis design, supporting processes such as glass bonding, polarizer assembly, and thin film coating, automating alignment and pressing, and significantly reducing defect rates.
The manufacturing of photovoltaic (PV) modules requires high-precision alignment and conductive bonding between cell units to improve power generation efficiency and structural stability. We offer a precision alignment platform designed specifically for the PV industry, featuring long stroke, multi-axis synchronization, and vision guidance. This platform can accurately perform key processes such as cell positioning, connecting wire arrays, and bonding encapsulation glass, ensuring consistent module quality and improving mass production efficiency.
Multilayer PCB alignment and lamination require micron-level precision. We provide a dual-stage integrated motion system paired with AOI and laser alignment to achieve precise PCB lamination positioning, target drilling, and component packaging. This solution fully supports high-end process requirements for HDI and IC substrates.
